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  • PRODUCTS 
    • AQUEOUS TECHNOLOGIES(PCB Washing Machine)
    • BP MICROSYSTEMS(Programming)
    • BTU REFLOW OVENS
    • DESCO(Anti-Static)
    • DIMA(Reflow Oven Dot Dispensing Manual Pick and Place)
    • EBSO(Component Counter)
    • EMS(Wave solder)
    • FOLUNGWIN(Wave Soldering)
    • GOEPEL(AOI SPI X RAY)
    • KYZEN(Cleaning Material)
    • MYDATA(Pick and Place)
    • NORDSON DAGE(X-Ray)
    • PACE(Solder and Rework)
    • PILLARHOUSE(Selective Wave Soldering)
    • SPEA(Inline Tester)
    • REPRINT(Stencil Printer)
    • MULTICORE(Solder Wire Solder Bar Solder Paste Flux)
    • V-TEK(Splicing Component Counters)
  • CONTACT
  • ABOUT
Production lines
​Placement equipment
The MY200 series
  • MY200HX
  • MY200DX
  • MY200SX
  • MY200LX
  • MY200 Synergy
  • Features and options
  • Technology
Component feeders
Jet printing equipment
Component storage
Software
Board Handling